New Delhi

Huawei's latest flagship smartphone, the Pura 70 Pro, has used more Chinese-made components, indicating China's pursuit of technological self-reliance.

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A thorough teardown analysis conducted by online tech repair company iFixit and consultancy TechSearch International revealed an increase in the presence of domestic suppliers, including a new flash memory storage chip and an upgraded chip processor.

These findings mark Huawei's endeavours to reduce reliance on foreign components while US-China trade tension continue to escalate.

The examination of the Pura 70 Pro uncovered a NAND flash memory chip likely packaged by Huawei's in-house chip unit, HiSilicon, alongside several other components sourced from Chinese suppliers.

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This shift towards domestic sourcing represents a concerted effort by Huawei to facilitate self-sufficiency in light of protracted US sanctions.

Shahram Mokhtari, iFixit's lead teardown technician, confirmed this, saying, "This is about self-sufficiency... everything you see... made by Chinese manufacturers, this is all about self-sufficiency."

The Pura 70 series' emergence amid Huawei's resurgence in the high-end smartphone market following years of US sanctions indicates its symbolic significance in the context of US-China trade frictions.

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Analysts anticipate Huawei's enhanced market positioning to intensify competition with industry leaders like Apple.

Meanwhile, policymakers in Washington scrutinise the efficacy of US restrictions imposed on Huawei, elaborating the geopolitical implications surrounding Huawei's technological advancements.

Notably, the Pura 70 Pro features a DRAM chip sourced from South Korea's SK Hynix, indicative of Huawei's diversified component procurement strategy.

However, the NAND flash memory chip, comprised of NAND dies with a capacity of 1 terabit, is likely produced by Huawei's HiSilicon unit.

While the manufacturer of the wafer remains unconfirmed, iFixit speculates that HiSilicon may have also developed the memory controller.

SK Hynix reiterated its compliance with relevant policies concerning dealings with Huawei.

The analysis of the Pura 70 Pro's processor suggests incremental improvements in Huawei's chip manufacturing capabilities, building upon the foundation laid by the Mate 60 series.

The processor, similar to its predecessor, is manufactured using Semiconductor Manufacturing International Corp's (SMIC) 7 nanometer (nm) N+2 process.

This continuity in chip architecture indicates steady progress in China's chip manufacturing prowess, despite ongoing geopolitical pressures.

While the similarities between the processors of the Mate 60 series and the Pura 70 Pro may suggest a perceived stagnation in technological advancement, experts caution against underestimating Huawei's resilience.

SMIC, Huawei's manufacturing partner, is set to transition to a 5nm manufacturing node.

(With inputs from Reuters)