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Xiaomi has spent $3 billion designing its own chips! It still has to build them in Taiwan

Xiaomi has spent $3 billion designing its own chips! It still has to build them in Taiwan

Xiaomi has spent $3 billion designing its own chips! It still has to build them in Taiwan

Story highlights

Xiaomi unveiled the Xring O3 on August 24, a 3-nanometre processor with 24 billion transistors on a 133 square millimetre die, alongside a neural chip and an autonomous-driving chip. It has put more than 20 billion yuan into the programme and grown its chip unit past 3,000 people. Every one of the chips is manufactured by TSMC in Taiwan.

Xiaomi announced three of its own chips this week. The design work is Chinese. The manufacturing is not, and that is the whole story of China's semiconductor position in one product launch.

What Was Announced

The Xring O3, unveiled on August 24, is built on TSMC's N3P three-nanometre node — 24 billion transistors on a die of 133 square millimetres, with LPDDR6 memory support. Xiaomi says it has entered mass production.

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Two more were confirmed alongside it. The Xring O100 is a six-nanometre neural processing unit intended to run MiMo, Xiaomi's own large language model, directly on consumer devices. The Xring D100 is a three-nanometre chip for autonomous driving. Both have completed development and are scheduled for deployment next year.

TSMC has been contracted to manufacture all three.

The Investment

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Xiaomi has now put more than 20 billion yuan — roughly $3 billion — into the Xring programme. Its semiconductor design unit has grown to more than 3,000 people, up from 2,500 a year ago.

That is a serious commitment by the standards of any phone maker. Only a handful of companies design their own flagship silicon at all: Apple, Samsung, Google to a degree, Huawei. Xiaomi has spent three years and $3 billion to join a very short list.

The Number That Complicates It

The O3 is aimed at an upcoming foldable phone, with production in the region of 200,000 to 300,000 units.

That is not a mass-market chip programme. Apple ships more iPhones in a morning. At those volumes the per-unit economics are dreadful, and the O3 cannot be understood as a commercial product in the ordinary sense.

It is better read as a capability demonstration — proof that Xiaomi can design a competitive flagship processor, aimed at reducing its dependence on Qualcomm over time and at competing with Huawei in the premium foldable segment where Chinese brands are fighting hardest.

Designing Is Not Making

The part that matters strategically is the one Xiaomi cannot solve with money.

A three-nanometre chip requires extreme ultraviolet lithography. Those machines are made by one company, ASML in the Netherlands, and export controls prevent their sale to Chinese foundries. SMIC, China's most advanced domestic manufacturer, has produced seven-nanometre parts using older equipment and multi-patterning, at yields and costs that make the approach difficult to scale.

So a Chinese company designing a leading-edge chip has one realistic route to production: TSMC, in Taiwan, using equipment China cannot buy.

Every Xring chip announced this week depends on that arrangement continuing.

The Exposure

This is worth stating plainly because it cuts against how these announcements are usually reported.

A Chinese national champion investing $3 billion to design its own silicon reads as a self-sufficiency story. It is closer to the opposite. Xiaomi has moved the dependency from buying finished chips from Qualcomm to buying manufacturing capacity from a Taiwanese firm operating under American export rules — a supply chain with more political exposure, not less, however much design capability sits behind it.

The same week made that exposure concrete elsewhere. Taiwanese prosecutors indicted nine people over restricted Nvidia server hardware allegedly routed to China through Indonesia and Japan, including employees at the Taiwan offices of the companies involved. And Nvidia's H200s, cleared for legal sale to approved Chinese buyers, are moving at around 13 per cent of licensed volume.

Every one of those stories runs through the same chokepoint.

What Would Actually Change It

Domestic fabrication at leading-edge nodes is the only thing that would, and nothing announced this week moves toward it.

China is investing enormously in that problem, and it is not obviously unsolvable — lithography is engineering rather than physics, and the country has closed harder gaps before. But it is a decade-scale undertaking, and the O3 shipping on TSMC N3P in 2026 is evidence of where the gap currently stands rather than of it narrowing.

The honest summary of Xiaomi's announcement is that China can now design chips as good as almost anyone's, and still cannot make them.

About the Author

Tarun Mishra

Tarun Mishra is a Sub-Editor at WION. He has worked with leading outlets doing investigative journalism and covering business, global affairs, technology, space exploration etc. Hi...Read More

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