The Union Cabinet on Wednesday (July 15) approved the second phase of the India Semiconductor Mission with an outlay of ₹1.27 lakh crore, as the government steps up efforts to position India as a global electronics manufacturing hub.&nbsp;Announcing the decision, Union IT Minister Ashwini Vaishnaw said, "The Cabinet has approved ISM 2.0 with a total outlay of ₹1.27 lakh crore."&nbsp;The Semicon 2.0 programme builds on the semiconductor initiative launched five years ago to reduce import dependence and attract investments in one of the world's most strategic industries.&nbsp;During the first phase of the India Semiconductor Mission, the government had allocated ₹76,000 crore. So far, it has cleared 12 projects under the programme, drawing investments worth around ₹1.64 lakh crore.&nbsp;A large share of the investment has come from Tata Electronics and its semiconductor business.&nbsp;Also Read: <a href="https://www.wionews.com/india-news/ahmedabad-air-india-crash-probe-draft-report-likely-by-october-aaib-opposes-release-of-cockpit-recordings-1784120546766">Ahmedabad Air India crash probe draft report likely by October, AAIB opposes release of cockpit recordings</a>&nbsp;<h2>Cabinet clears multiple projects worth ₹2.19 trillion</h2>Along with Semicon 2.0, the Cabinet approved the Mobile Phone Manufacturing Scheme (MPMS) with an allocation of ₹62,500 crore, making it one of the government's key manufacturing initiatives.&nbsp;Vaishnaw also announced that the Cabinet had approved the National Investment Policy for Urea 2026, saying the policy is aimed at making India self-reliant in urea production. He clarified that the approval is a policy decision and does not involve any financial allocation in the Cabinet decisions table.&nbsp;The Cabinet also cleared two railway infrastructure projects. It approved the doubling of the Paradeep to Haridaspur railway line at a cost of ₹2,542 crore. It also approved the fourth railway line between Dangoaposi and Rajkharsawan with an investment of ₹1,365 crore.&nbsp;"Seven major decisions were taken today. The first two decisions relate to a new approach to infrastructure development in Varanasi (Kashi). The third and fourth decisions are related to the approval of Semiconductor Mission 2.0 (Semicon 2.0). The fourth decision is the approval of the Mobile Phone Manufacturing Scheme. The fifth decision is aimed at making India self-reliant in urea production. For this, the National Investment Policy for Urea has been approved," he said.

The Union Cabinet approved a ₹1.27 trillion Semiconductor Mission 2.0 along with a ₹62,500 crore Mobile Phone Manufacturing Scheme and other key policy and infrastructure measures to strengthen India's manufacturing ecosystem.

The Union Cabinet on Wednesday (July 15) approved the second phase of the India Semiconductor Mission with an outlay of ₹1.27 lakh crore, as the government steps up efforts to position India as a global electronics manufacturing hub. Announcing the decision, Union IT Minister Ashwini Vaishnaw said, "The Cabinet has approved ISM 2.0 with a total outlay of ₹1.27 lakh crore." The Semicon 2.0 programme builds on the semiconductor initiative launched five years ago to reduce import dependence and attract investments in one of the world's most strategic industries. During the first phase of the India Semiconductor Mission, the government had allocated ₹76,000 crore. So far, it has cleared 12 projects under the programme, drawing investments worth around ₹1.64 lakh crore. A large share of the investment has come from Tata Electronics and its semiconductor business. Also Read: Ahmedabad Air India crash probe draft report likely by October, AAIB opposes release of cockpit recordings Cabinet clears multiple projects worth ₹2.19 trillion Along with Semicon 2.0, the Cabinet approved the Mobile Phone Manufacturing Scheme (MPMS) with an allocation of ₹62,500 crore, making it one of the government's key manufacturing initiatives. Vaishnaw also announced that the Cabinet had approved the National Investment Policy for Urea 2026, saying the policy is aimed at making India self-reliant in urea production. He clarified that the approval is a policy decision and does not involve any financial allocation in the Cabinet decisions table. The Cabinet also cleared two railway infrastructure projects. It approved the doubling of the Paradeep to Haridaspur railway line at a cost of ₹2,542 crore. It also approved the fourth railway line between Dangoaposi and Rajkharsawan with an investment of ₹1,365 crore. "Seven major decisions were taken today. The first two decisions relate to a new approach to infrastructure development in Varanasi (Kashi). The third and fourth decisions are related to the approval of Semiconductor Mission 2.0 (Semicon 2.0). The fourth decision is the approval of the Mobile Phone Manufacturing Scheme. The fifth decision is aimed at making India self-reliant in urea production. For this, the National Investment Policy for Urea has been approved," he said.

The Union Cabinet approved a ₹1.27 trillion Semiconductor Mission 2.0 along with a ₹62,500 crore Mobile Phone Manufacturing Scheme and other key policy and infrastructure measures to strengthen India's manufacturing ecosystem.

Cabinet approves ₹1.27 trillion for India Semiconductor Mission 2.0 to boost chip manufacturing

Prime Minister Narendra Modi on Saturday (Feb 21) launched the India Chip Private Limited, a pioneering joint venture between HCL and Foxconn for domestic semiconductor production. Addressing the groundbreaking ceremony of the OSAT (Outsourced Semiconductor Assembly and Test) facility in the northern city of Jewar in Uttar Pradesh via video conferencing, Modi stressed India’s push for chipmaking self-reliance.“India must become self-reliant in chip manufacturing... For this... we need to build a semiconductor ecosystem in India,” Modi said, adding that the nation is working simultaneously on both software and hardware aspects of technology.“It is a matter of pride for all of us that Uttar Pradesh is also set to become a major centre in India’s semiconductor ecosystem. This new HCL and Foxconn factory... will further strengthen UP’s new identity as a technology powerhouse,” he said.<a href="https://www.wionews.com/videos/western-dual-use-chips-reportedly-reached-russia-via-north-korea-hong-kong-1771558191370/embed">https://www.wionews.com/videos/western-dual-use-chips-reportedly-reached-russia-via-north-korea-hong-kong-1771558191370/embed</a><h2>A step towards technological self-reliance</h2>This is Uttar Pradesh’s first OSAT facility and India’s sixth approved semiconductor project.The joint venture between Indian IT giant HCL Technologies and Taiwanese electronics manufacturer Foxconn is located in the Yamuna Expressway Industrial Development Authority (YEIDA) area in Uttar Pradesh, near the upcoming Noida International Airport.Spanning approximately 48 acres, the facility has an investment of more than Rs 3,700 crore.Foxconn holds a 40 per cent equity stake, having invested $37.2 million (around Rs 312 crore), with possible additional investment of up to Rs 424 crore.The project is being developed under the modified scheme for semiconductor ATMP, or Assembly, Testing, Marking and Packaging.Also read: <a href="https://www.wionews.com/world/not-about-china-why-india-joining-pax-silica-alliance-on-rare-earths-supply-chain-chip-making-and-ai-is-a-big-deal-1771580224467">Not about China? Why India joining Pax Silica alliance on rare earths supply chain, chip making and AI is a big deal</a><h2>What will the OSAT facility make?</h2>The facility aims to enhance high-end manufacturing capabilities in sectors such as mobile phones, tablets, laptops and automotive electronics.It will focus on display driver integrated circuits for smartphones, laptops, automotive applications and other consumer electronics, according to reports.The facility is expected to generate thousands of direct and indirect jobs for engineers, technicians and skilled professionals, and to catalyse growth in ancillary industries, design houses, R&amp;D centres and a start-up ecosystem around semiconductors, said a release from the government.Also read: <a href="https://www.wionews.com/opinions/from-chips-to-chatbots-how-india-is-chasing-ai-billions-1771413723048">From chips to chatbots: How India is chasing AI billions</a><h2>India’s growth in chip ecosystem</h2>The new facility is a significant step in strengthening India’s self-reliance and its presence in the global chip ecosystem.It will help India reduce import dependence, build resilient supply chains and promote innovation, skill development and technology transfer.The new facility aligns with government initiatives such as Make in India and Digital India, as well as Atmanirbhar Bharat, or a self-reliant India.

Prime Minister Modi attended the groundbreaking ceremony of a new semiconductor facility in Uttar Pradesh. The HCL and Foxconn joint venture boosts India’s chip manufacturing, self-reliance, jobs and high-end electronics production.

Prime Minister Narendra Modi on Saturday (Feb 21) launched the India Chip Private Limited, a pioneering joint venture between HCL and Foxconn for domestic semiconductor production. Addressing the groundbreaking ceremony of the OSAT (Outsourced Semiconductor Assembly and Test) facility in the northern city of Jewar in Uttar Pradesh via video conferencing, Modi stressed India’s push for chipmaking self-reliance. “India must become self-reliant in chip manufacturing... For this... we need to build a semiconductor ecosystem in India,” Modi said, adding that the nation is working simultaneously on both software and hardware aspects of technology. “It is a matter of pride for all of us that Uttar Pradesh is also set to become a major centre in India’s semiconductor ecosystem. This new HCL and Foxconn factory... will further strengthen UP’s new identity as a technology powerhouse,” he said. https://www.wionews.com/videos/western-dual-use-chips-reportedly-reached-russia-via-north-korea-hong-kong-1771558191370/embed A step towards technological self-reliance This is Uttar Pradesh’s first OSAT facility and India’s sixth approved semiconductor project. The joint venture between Indian IT giant HCL Technologies and Taiwanese electronics manufacturer Foxconn is located in the Yamuna Expressway Industrial Development Authority (YEIDA) area in Uttar Pradesh, near the upcoming Noida International Airport. Spanning approximately 48 acres, the facility has an investment of more than Rs 3,700 crore. Foxconn holds a 40 per cent equity stake, having invested $37.2 million (around Rs 312 crore), with possible additional investment of up to Rs 424 crore. The project is being developed under the modified scheme for semiconductor ATMP, or Assembly, Testing, Marking and Packaging. Also read: Not about China? Why India joining Pax Silica alliance on rare earths supply chain, chip making and AI is a big deal What will the OSAT facility make? The facility aims to enhance high-end manufacturing capabilities in sectors such as mobile phones, tablets, laptops and automotive electronics. It will focus on display driver integrated circuits for smartphones, laptops, automotive applications and other consumer electronics, according to reports. The facility is expected to generate thousands of direct and indirect jobs for engineers, technicians and skilled professionals, and to catalyse growth in ancillary industries, design houses, R&D centres and a start-up ecosystem around semiconductors, said a release from the government. Also read: From chips to chatbots: How India is chasing AI billions India’s growth in chip ecosystem The new facility is a significant step in strengthening India’s self-reliance and its presence in the global chip ecosystem. It will help India reduce import dependence, build resilient supply chains and promote innovation, skill development and technology transfer. The new facility aligns with government initiatives such as Make in India and Digital India, as well as Atmanirbhar Bharat, or a self-reliant India.

Prime Minister Modi attended the groundbreaking ceremony of a new semiconductor facility in Uttar Pradesh. The HCL and Foxconn joint venture boosts India’s chip manufacturing, self-reliance, jobs and high-end electronics production. Here is what you should know

India Chip Private Limited launched by PM Modi: Why is it important and what will it make?

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Cabinet approves ₹1.27 trillion for India Semiconductor Mission 2.0 to boost chip manufacturing

India Chip Private Limited launched by PM Modi: Why is it important?